————Hollow Orange Flap Bicomponent Microfilament Nonwoven
Sebopeho: 70% pol + -yester + 30% polyamide.
Boima ba 'mele: 48gsm ~ 200gsm.
Bophara: Max.1.75m.
Bokhabane: 0.05-0.2dtex.
Li-spunlace + spunbond, Polyester le Polyamide chips li ohliloe ka har'a likhoele tse sa feleng tse arohaneng 'me bophara ba fiber bo tla laoloa pakeng tsa 0.05-0.15D, e batlang e le 1/10 ea microfiber e akaretsang.
E entsoe ka "supercontinuous bicomponent filament" e nang le sefapano se nang le "pie" e nang le likarolo tse ngata tsa mofuta oa "pie" （Hollow Orange Flap Bicomponent.Microfilament Spunbond Spunlaced Nonwoven).
Ka lebaka la li-jets tsa metsi tse nang le khatello e phahameng, likhoele li arotsoe ka li-microfilaments.
Nako ea poso: May-19-2023